Effect of epoxy resin and hardener containing microcapsules on healing efficiency of epoxy adhesive based metal joints

Abstract

Dual component microcapsules of epoxy resin and polyamine hardener with polymethyl methacrylate (PMMA) shell were synthesized using a water-oil-water emulsion solvent evaporation method. The high concentration of sodium dodecyl sulfate (SDS) was used to reduce the thickness of shell wall of dual component microcapsules. The dual microcapsules of 1:1 weight ratio were introduced in the epoxy adhesive to study the healing effect. The morphology, chemical structure and thermal characteristics of the microcapsules were characterized by scanning electron microscopy (SEM), Fourier-transform infrared spectroscopy (FTIR) and thermogravimetric analysis (TGA), respectively. The insertion of dual component microcapsules in epoxy matrix reduced the lap shear strength of adhesive joints, which may be attributed to the generation of stress concentration cites because of micron sized capsules. However, the extension and absorbed failure energy of adhesive joints under uniaxial loading increased with the increase of concentration of dual microcapsules. The viscoelastic nature of the dual microcapsules may be responsible for this enhancement. Significant enhancement in the healing efficiency (90.93%) of the joints was achieved for 10 wt% of dual microcapsules. The crack pinning and crack blunting mechanisms at the vicinity of the crack path adjacent to the microcapsules were found responsible for significant enhancement in the healing efficiency of the adhesive joints.