Abstract
In sonic infrared imaging, the engagement force strongly affects the plate׳s vibration characteristics and frictional heating at the crack, which have been proved by experimental results. We developed a FEM model in which piezoelectric-force analogy was employed to simulate inverse piezoelectric effect. Simulation results revealed that an increase in the engagement force not only enhances the vibration intensity of the test plate but also causes a sharp change in its spatial distribution. However, when the increase exceeds a certain level, the enhanced crack closure and weakened crack differential velocity will lead to a lower heat dissipating at the crack.
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