Abstract
In this paper, vibration tests are conducted to investigate the influence of temperature on PCB responses. A set of combined tests of temperature and vibration is designed to evaluate solder interconnect reliability at 25°C, 65°C and 105°C. Results indicate that temperature significantly affects PCB responses, which leads to remarkable differences in vibration loading intensity. The PCB eigenfrequency shifts from 290Hz to 276Hz with an increase of test temperature from 25°C to 105°C, during which the peak strain amplitude is almost the same.Vibration reliability of solder interconnects is greatly improved with temperature rise from 25°C to 105°C. Mean time to failure (MTTF) of solder joint at 65°C and 105°C is increased by 70% and 174% respectively compared to that of solder joint at 25°C. Temperature dominates crack propagation path of solder joint during vibration test. Crack propagation path is changed from the area between intermetallic compound (IMC) layer and Cu pad to the bulk solder with temperature increase.
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