Effect of dwell times on thermomechanical fatigue behavior of Sn-Ag-based solder joints

Abstract

Thermomechanical fatigue (TMF) caused by the mismatch in the coefficient of thermal expansion (CTE) between solder and substrate gradually degrades the mechanical properties of solder joints during service. Solder joints fabricated with eutectic Sn-Ag and Sn-Ag solder with Cu or Ni were subjected to TMF between −15°C and +150°C with dwell times of 115 min at high-temperature extreme and 20 min at low-temperature extreme. Characterization of surface damage and residual-mechanical strength of these solder joints were carried out after 0, 250, 500, and 1,000 TMF cycles. Results obtained from this study were compared with those obtained with longer dwell time at lower temperature extreme. The solder joints that experienced longer dwell times at high-temperature extreme exhibited less surface-damage accumulation and less decrease in simple-shear strength as compared to those that experienced longer dwell times at low-temperature extreme. Quaternary alloys containing small amounts of Cu and Ni exhibit better TMF performance than binary and ternary alloys under TMF cycling with longer dwell times at high-temperature extreme.