Abstract
The effect of Sb addition on IMC growth in Sn-3.5 Ag-0.7 Cu solder joints has been studied in this work. IMC morphologies of Sn-3.8 Ag-0.7 Cu solder joints have been changed as a result of the Sb addition. The IMC layer becomes thinner with the increase in Sb proportion. It is observed that the fine particles precipitating increase in IMC layer with the increase in Sb proportion during reflow. Sb addition can increase the activation energy of Sn-3.8 Ag-0.7 Cu solder alloy system, and reduce the atomic diffusion rate, so as to inhibit the excessive growth of the IMC. It is found that the solder alloy with about 0.8 wt% Sb has the highest activation energy and lowest interdiffusion coefficient for the formation of the IMCs. The tensile strength can be slightly improved by Sb addition and is significantly affected by the IMC formation in solder joints.
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