Abstract
Heat dissipation is an important part of light-emitting diode (LED) filament research and has aroused constant concern. In this paper, we studied the thermal performance of flexible LED filament by numerical simulation and through experiment. The heat dissipation characteristics of spring-like structure flexible LED filament were computed by finite volume method, and it was found that the chip junction temperature was closely related to the pitch and the bending radius. The effect of inclination angle of lighting LED filament was discussed because it is relevant to the spring-like structure flexible LED filament in geometry. The results demonstrated that the temperature of the filament increases as the inclination angle improves.
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