Effect of Different Amount of Silicon Carbide on SAC Solder-Cu Joint Performance by Using Microwave Hybrid Heating Method

Abstract

Microwave hybrid heating (MHH) has been recognized for the soldering process especially with lead-free solder alloy. This study seeks to investigate the effect of the different amount of susceptor on the Sn-3.0Ag-0.5Cu-Copper (SAC305-Cu) joint performance by using the MHH method. The susceptor material that was used to facilitate microwave heating in this study was Silicone Carbide (SiC). Different amount of SiC was used to compare its effect on the intermetallic compound (IMC) formed and shear strength at the solder joint. Domestic microwave with operating frequency 2.45GHz and 800W was used to join the solder and Cu substrate for 5, 6 and 7 minutes. Characterization of the samples was carried out using an optical microscope, image analyzer, and lap shear test. The microstructural study showed that scallop type structure of Cu6Sn5 was found at the SAC305/Cu interface after soldering with MHH technique. Thinnest Cu6Sn5 IMC (14.909 mm) were obtained by soldering with 6 g of SiC for 6 minutes while highest shear strength was observed when 4 g of SiC was used for soldering for 7 minutes (26.71 MPa).