Abstract
Low melting point metal (LMPM) based composite containing particles with high thermal conductivity has potential application prospects in the field of thermal management. To investigate the influence of particles with high thermal conductivity on the thermal behavior of LMPM during its melting/solidification process, lead free eutectic field's metal Bi32.5In51Sn16.5 was selected as the LMPM and diamond microparticles were used as the thermal conductive reinforcement. The thermal conductivity of the LMPM increased 85% as the mass fraction of diamond particles was 4.7%. Thermal performance of LMPM-based heat sink influenced by diamond particles was studied. Compared with the LMPM-based heat sink, heating element using heat sink filled with LMPM/diamond composites maintained a lower temperature during long-time heating and cooled faster as its power-off. The effect of diamond particles on the melting/solidification process of LMPM was investigated. The melting duration of LMPM was prolonged by adding diamond particles. After LMPM was compounded with diamond, the subcooling existing in LMPM was reduced and its initial solidification time was shortened. The thermal performance of LMPM/diamond-based heat sink showed more stability than that of LMPM-based heat sink during the heating/cooling cyclic tests. Meantime, the relative position of diamond particles in LMPM was basically immobile through 1000 melting/solidification cyclic tests.
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