Effect of diameter of metal nanowires on pool boiling heat transfer with FC-72

Abstract

Effect of varying diameter of metal nanowires on pool boiling heat transfer performance is presented in this study. Copper nanowires (CuNWs) of four different diameters (∼35nm, ∼70nm, ∼130nm and ∼200nm) were grown directly on copper specimen using template-based electrodeposition technique. Both critical heat flux (CHF) and boiling heat transfer coefficient (h) were found to be improved in surfaces with nanowires as compared to the bare copper surface. Moreover, both the parameters were found to increase with increasing diameter of the nanowires. The percentage increases observed in CHF for the samples with nanowires were 38.37%, 40.16%, 48.48% and 45.57% whereas the percentage increase in the heat transfer coefficient were 86.36%, 95.45%, 184.1% and 131.82% respectively as compared to the bare copper surface. Important reasons believed for this enhancement were improvement in micron scale cavity density and cavity size which arises as a result of the coagulation and grouping of nanowires during the drying process. In addition to this, superhydrophilic nature, capillary effect, and enhanced bubble dynamics parameters (bubble frequency, bubble departure diameter, and nucleation site density) were found to be the concurring mechanisms responsible for this enhancement in heat transfer performance. Qualitative bubble dynamics analysis was done for the surfaces involved and the visual observations are provided to support the results presented and discussed.