Abstract

By employing a cyclic warm rolling technique, MoCu30 alloy sheets of different thicknesses were prepared to investigate the effects of various rolling reduction rates on the microstructure and mechanical properties of MoCu30 alloys. Additionally, the evolution of microscale heterogeneous deformation during the tensile process was observed based on DIC technology. This study reveals that Mo-Cu interfaces at different deformation rates exhibit an amorphous interlayer of 0.5-1.0 μm thickness, which contributes to enhancing the bond strength of Mo-Cu interfaces. As the rolling reduction rate increased, the grain size of the MoCu30 alloy gradually decreased, whereas the dislocation density and hardness increased. Furthermore, the yield strength and tensile strength of the MoCu30 alloy increased gradually, whereas the elongation decreased. At a deformation rate of 74% (2 mm), the yield strength, tensile strength, and elongation of the MoCu30 alloy were 647.9 MPa, 781.8 MPa, and 11.7%, respectively. During the tensile process of Mo-Cu dual-phase heterogeneous material, a unique hierarchical strain banding was formed, which helps to suppress strain localization and prevent premature plastic instability.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.