Abstract
用传统固相法制备了(1- x )BaTiO 3 / x Cu( x =5 wt%, 10 wt%, 15 wt%, 20 wt%, 25 wt%,30 wt%)复相陶瓷, 研究了Cu含量对复相陶瓷材料的显微结构、渗流阈值及介电性能的影响. 研究结果表明BaTiO 3 /Cu复相陶瓷材料的电阻率随着铜含量的增加而下降, 且在渗流阈值( x =25wt%)附近呈现非线性的下降趋势, 复合材料从绝缘体逐渐变为导体. 室温下1 kHz当Cu含量达到 x =30wt%时复相陶瓷的介电常数为~9000, 这是由于在导体和绝缘体的相界面处积累大量的空间电荷, 并由此产生界面极化, 导致介电常数的显著增大, 且随着导体含量的增加, 这种界面效应更加明显. 复相陶瓷的介电损耗随着铜含量的增加而增大, 但随着频率的升高, 由于空间电荷的减少又会使损耗呈现下降的趋势. 在25~115℃的温度范围内, 复相陶瓷温度系数小于5%,具有很高的介电常数温度稳定性.
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