Abstract
In this paper, the effects of Cu content on the interfacial reactions of Sn-xCu/Cu solder joints were systematically investigated. The examined Cu compositions varied from 0.98 wt% to 11.62 wt%. The reflow and aging processes were performed on Sn-xCu/Cu couples at 280 °C and 180 °C, respectively. Experimental results indicated that the microhardness of as-solidified Sn-xCu solder alloys increased obviously with increasing Cu content. After reflowing, the classical reaction products, Cu6Sn5 and Cu3Sn, were found at the interface of Sn-xCu/Cu couples. The size of Cu6Sn5 grain increased slightly and Cu6Sn5 layer surface also gradually changed from sawtooth-type to scallop-type when the Cu content increased in solder (from 0.98 wt% to 11.62 wt%). Moreover, with extended aging time, the total IMC layer thickened and the morphologies of the Cu6Sn5 IMC layer gradually transformed from scallop-type to planar-type during the thermal aging process. The thickness of Cu3Sn layer also increased with the increase of aging time, as well as the increase of Cu content in solder alloy.
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