Abstract
The crystallinity of electroless nickel deposit was manipulated by applying bath stabilizer including lead acetate and thiourea. A crystalline deposit and a higher deposition rate of electroless nickel were achieved with thiourea than with lead acetate. The effect of crystallinity on the diffusion barrier performance of the electroless nickel deposit was studied between solder and Cu deposit. The thickness of the electroless nickel deposit investigated includes 1, 3, and 5 /spl mu/m. It was found that both crystalline and amorphous deposits perform similarly in barrier performance except when the thickness of the deposit is as thin as 1 /spl mu/m. Cross sectional elemental analysis results indicate that a 3 /spl mu/m thickness deposit can withstand ten times of reflow without counter diffusion between Sn and Cu, although Ni-Sn intermetallic compounds were formed. The 3 /spl mu/m thickness is also adequate for barrier function after 1000 hours of aging at 150/spl deg/C.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
