Abstract
Infrared spectroscopy and dielectric properties were used to investigate the molecular structure and the degree of cross-linking in denture base resins by the determination of the amount of residual monomer. It was found that the addition of triethylene glycol dimethacrylate (TEGDMA) or tetrahydrofurfuryl methacrylate (THFMA) with 12% or 17% by weight of the monomer to the resins reduces the amount of residual monomer in the heat-cured denture base resins. It was found that the dielectric constant and the absorbance of the C-C bond at 1625cm−1 increased with increasing residual monomer content. The results also indicated that the dielectric constant varies linearly with the absorbance ratio,A (1625 cm−1)/A (1725cm−1).
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have