Abstract
The effect of micro-alloying elements of Cr and Sn on microstructures, mechanical-electrical properties and softening resistance of the novel Cu–Cr–Sn alloys were investigated in details by transmission electron microscopy (TEM), atom probe tomography (APT), electron backscatter diffraction (EBSD) and X-ray diffraction (XRD). The results showed that the tensile strength, yield strength, microhardness and electrical conductivity of Cu-0.67Cr-0.23Sn alloy by 80% cold-rolling and aging at 400 °C for 2 h can reach 566.3 MPa, 527.6 MPa, 186.2 HV and 73.3 %IACS, respectively. The TEM and APT analysis indicated Sn addition can promote the precipitation of Cr phase and inhibit the coarsening of Cr precipitates, thus improving the strength of Cu–Cr–Sn alloy. The precipitation strengthening was the dominant mechanism for improving the yield strength of Cu–Cr–Sn alloys. Besides, the designed Cu–Cr–Sn alloys exhibited a high softening temperature since the addition of Sn inhibited the coarsening of Cr precipitates and delayed the recrystallization of deformed structure.
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