Abstract
The polyimide precursor, poly(amic acid) (PAA) (II), was synthesized from 4,4'-oxydiphthalic dianhydride (ODPA) and 4,4'-bis(4-aminophenoxy)biphenyl (I). Two polyimides/silica composites with covalent (V series) and non-covalent bonds (VI series) were then prepared and compared in this study. V series used the coupling agent of 3-aminopropyltrimethoxysilane (APrTMOS) to form the PAA-silane precursor (III). Finally, the covalent bonds characteristics of V series were prepared from III and tetramethoxysilane (TMOS) via a combination of thermal imidization and sol–gel process. The resulting V series hybrid films showed mechanically robust and optically transparent even at high silica content (40 wt %). In addition, excellent thermal stability (10% weight loss temperature in excess of 550°C, and char yield higher than 60% under nitrogen at 800°C). In addition, the non-covalent bonding hybrid films prepared from II and TMOS were also conducted and compared in this study.
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