Abstract
The electrochemical behaviour of a copper coated p-type InP electrode has been investigated. The copper coating was obtained by electrodeposition from a Cu 2+ containing sulfuric acid solution under illumination. This reduction reaction can compete with H + reduction and with its side reaction, the cathodic decomposition of InP, depending on the illumination level, on the Cu 2+ concentration in the electrolyte, and on the rotation speed of the electrode. It appears that when the amount of Cu 2+ at the InP|electrolyte interface is sufficient to convert the whole flux of the photocarriers, the Cu 2+ reduction becomes the main photoprocess, hindering the hydrogen evolution and the cathodic decomposition. A metal deposit up to about 100 equivalent monolayers can form on the electrode surface without any decrease of the photocurrent, as a result of a non-uniform coverage rate of the metal.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
