Abstract
The microstructure and shear strength of a transition joint consisting of Sn–Ag–Cu solder alloy and Cu substrate were evaluated in reflowed condition. The results were compared with those obtained from a similar joint made with conventional eutectic Sn–Pb solder alloy. The reaction products at the interface are mainly Cu 6Sn 5 and Cu 3Sn along with Cu 6Sn 5 for Sn–Pb and Sn–Ag–Cu to Cu joint, respectively. The shear strengths of the two systems are ∼55 and ∼68 MPa, respectively. The fracture takes place through the Cu 6Sn 5 intermetallic phase as well as through the solder alloy and the strength depends on the thickness of the reaction layer. The width of the brittle reaction layer at the interface for Sn–Ag–Cu to Cu transition joint is thinner with respect to Sn–Pb to Cu joint; hence the shear strength of the former is superior to the latter.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
