Abstract
TC18 and TC18–0.5Cu alloys were prepared by vacuum arc furnace melting. The properties of its passivation film in 5 % NaCl solution were investigated using constant potential polarization, electrochemical impedance spectroscopy, Mott-Schottky and XPS analysis. The corrosion resistance of TC18 passivation films was found to be superior to that of TC18–0.5Cu alloy. The passivation films formed on both alloys displayed n-type semiconductor behavior. In the TC18–0.5Cu alloy, the presence of copper as a form of copper interstitial segregation Cuix+ was observed, which was subsequently replaced by low-mobility titanium ionic vacancies in the form of a cationic sublattice CuTix′, as a small defect.
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