Effect of Cooling Rate on the Microstructure and Mechanical Properties of Sn-1.0Ag-0.5Cu–0.2BaTiO3 Composite Solder

Abstract

The microstructure, interfacial intermetallic compound (IMC) layer, microhardness, tensile properties, and fracture surfaces of Sn-1.0Ag-0.5Cu–0.2BaTiO3 composite solder were explored under three different cooling conditions (water-, air-, and furnace-cooled) during solidification. The average grain size was refined and the volume fraction of primary β-Sn dendrites increased with increasing cooling rate. The thickness of the IMC layer increased as the cooling rate was decreased, and the morphology also transformed from scallop shaped, for a rapid cooling rate, to irregular shaped for slower cooling; a Cu3Sn IMC layer was detected between the Cu6Sn5 IMC and copper substrate under the furnace-cooled condition, but not in water- or air-cooled specimens. The mechanical properties, including the microhardness and tensile properties, improved with rapid solidification due to the combined effects of grain refinement and a secondary strengthening mechanism. Fracture surfaces after tensile tests showed that the amount of dimples decreased and a cleavage-like pattern increased as the cooling rate was decreased from the water-cooled to furnace-cooled condition, so the fracture process transformed from ductile to mixed-mode fracture. A refined microstructure and excellent mechanical properties were obtained for the rapidly cooled sample.