Abstract
ABSTRACT The effect of conjugate heat transfer resulting from a microelectromechanical systems (MEMS)-based thermal shear stress is investigated. Due to the length-scale disparity and large solid–fluid thermal conductivity ratio, a two-level computation is used to examine the relevant physical mechanisms and their influences on wall shear stress. The substantial variations in transport properties between the fluid and solid phases and their interplay with regard to heat transfer and near-wall fluid flow structures are investigated. It is demonstrated that for state-of-the-art sensor design, the buoyancy effect can noticeably affect the accuracy of the shear stress measurement.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
