Abstract
Sn–Sb lead-free solders are considered to substitute the tin–lead solders due to their great mechanical properties. At room temperature, the mechanical properties of Ni/Au/Sn–5Sb/Au/Ni and Ni/Au/Sn–5Sb–0.3Ag–0.05Cu/Au/Ni linear solder joints were investigated by nanoindentation experiments at different loads. The results showed that the Sn–Sb intermetallic compound (IMC) was distributed in the β-Sn matrix in Ni/Au/Sn–5Sb/Au/Ni solder joints. Co-addition of Cu and Ag resulted in the formation of the rod-shaped Cu6Sn5 and the fine granular Ag3Sn IMCs. At the same load and loading/unloading rate, the indentation depth and residual indentation morphologies of Ni/Au/Sn–5Sb–0.3Ag–0.05Cu/Au/Ni solder joints were smaller than those of Ni/Au/Sn–5Sb/Au/Ni solder joints. The hardness of the two kinds of solder joints decreased with the increase in load, while the Young’s modulus was independent of load. In addition, compared to the Ni/Au/Sn–5Sb/Au/Ni solder joints, the hardness, Young’s modulus and stress exponents of Ni/Au/Sn–5Sb–0.3Ag–0.05Cu/Au/Ni solder joints achieved an improvement due to the co-addition of Ag and Cu.
Highlights
With the advantages of good wettability, solderability and suitable price, SnPb solder has been used commonly as brazing material in the field of electronic packaging
The results showed that the Sn–Sb intermetallic compound (IMC) was distributed in the b-Sn matrix in Ni/Au/Sn–5Sb/Au/Ni solder joints
In order to evaluate the mechanical properties of Ni/Au/ Sn–5Sb/Au/Ni and Ni/Au/Sn–5Sb–0.3Ag–0.05Cu/Au/Ni linear solder joints, all samples were tested on KLA Nano Indenter G200 with a 115° Berkovich indenter at room temperature
Summary
With the advantages of good wettability, solderability and suitable price, SnPb solder has been used commonly as brazing material in the field of electronic packaging. Nanoindentation experiments have proved to be a more effective method to evaluate the mechanical properties of the micro-area of materials due to the advantages of not being affected by the structure and volume of the materials This method obtains the continuous load–displacement curve by recording the variations of load and depth of the indenter into the material, and the hardness, Young’s modulus and stress exponent can be obtained [14,15,16,17,18]. The nanoindentation experiments were carried out at different loads to test the hardness, Young’s modulus and stress exponents of two kinds of solder joints and explore the influence of co-addition of Ag and Cu on mechanical properties of Sn–5Sb solder. In order to evaluate the mechanical properties of Ni/Au/ Sn–5Sb/Au/Ni and Ni/Au/Sn–5Sb–0.3Ag–0.05Cu/Au/Ni linear solder joints, all samples were tested on KLA Nano Indenter G200 with a 115° Berkovich indenter at room temperature. The SEM test was performed on solder joints to observe the indentation morphology at different maximum loads
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