Abstract

ABSTRACTThe surface modification of stainless‐steel (SS) mesh was carried out by chemical etching for different time, and then, the etched SS meshes were used as the interlayer heating element for resistance welding of glass fabric‐reinforced polyetherimide (GF/PEI) composite laminates. The hydrophobicity and tensile strength of the etched and untreated SS wires and interfacial shear strength (IFSS) between SS wire and PEI resin were investigated by dynamic contact angle (DCA) analyzer and single fiber pull‐out test to evaluate the influence of the degree of chemical etching on the bonding strength of PEI resin and SS surface. Tensile lap‐shear strength (LSS) and scanning electron microscope (SEM) analysis were performed to investigate the welding interface strength and fracture morphologies of the resistance‐welded joint of the GF/PEI laminates. The hydrophobicity and tensile strength of SS wires were increased and decreased respectively with etching time (te). The IFSS of SS wire/PEI resin showed an improvement with te. The LSS was increased first and then decreased with te, and the optimal te was 30 min when LSS reached the maximum. Fracture analysis showed the main failure mode of the welded joints was the interlayer debonding when welding time (tw) was insufficient. With the extension of tw, the failure mode gradually switched into the intralayer tearing of the SS implant. © 2019 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019, 136, 47879.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.