Abstract
The effects of a CF 4 plasma treatment on the interfacial fracture energy of an inkjet-printed Ag/polyimide system were investigated for inkjet printing metallization techniques in flexible printed circuit board applications. The interfacial fracture energy was evaluated by using a 180° peel test and by calculating the plastic deformation energy of the peeled metal and polyimide films from an energy balance relationship during the steady-state peeling process. The interfacial fracture energy between the Ag and the polyimide increased after the CF 4 plasma treatment to the polyimide surface. This was caused by an increase in the surface roughness as well as changes to the surface functional groups of the polyimide film. Therefore, both the mechanical interlocking effect and the chemical bonding effect were responsible for the improvement in the interfacial adhesion in inkjet-printed Ag/polyimide systems.
Sign-in/Register to access full text options 
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
