Abstract

Directionally solidified experiments were performed on Al-2%Cu and Al-4.5%Cu alloys to investigate the variation of interface morphology and dendrite arm spacing with the different additions of Ce. The planar and cellular interface of Al-2%Cu-Ce and Al-4.5%Cu-Ce are more unstable than that of Al-2%Cu and Al-4.5%Cu. The higher the Ce content is, the more unstable is the interface. The primary arm spacing goes through a minimum with increasing Ce concentration. The secondary arm spacing decreases with an increase of Ce content. These effects of Ce on interface morphology and dendritic spacings are attributed by the authors to the analogous content C mn , and the authors also suggest that it is applicable to explain the role of the microelements during the solidification process by using the analogous content C mn conception.

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