Abstract
Conductive copper inks have attracted much attention as low-cost replacement for the currently used silver inks for printed electronics. The copper inks should be stable to oxidation at all stages of fabrication of conductive patterns: ink formulation and storage, printing, and post-printing treatment. In the present study, air-stable copper-silver core-shell (Cu@Ag) submicron particles were utilized in conductive ink formulations. To improve the conductivity of the resulting Cu@Ag coatings, the effect of various carboxylic acids was evaluated. It was found that all acids led to decreased resistivity after sintering at elevated temperatures, while the lowest value was only 4 times higher than the bulk resistivity at 3wt% of oleic. The mechanism governing the effect of carboxylic acids is discussed, in view of possible stabilizer exchange and oxide dissolution.
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