Abstract

The effect of carbon dioxide on sodium chloride (NaCl) induced atmospheric corrosion of copper was studied in laboratory exposures using microgravimetry, ion chromatography, Fourier transform infrared spectroscopy, and scanning electron microscopy with X-ray microanalysis. With lower amount of NaCl particles on the copper surface , the corrosion rate was higher with than with , and for higher amount of NaCl , the corrosion was higher with . With lower amount of NaCl and low concentration, a secondary spreading of electrolyte occurred from the droplets that formed at the particle clusters. This led to a larger effective cathodic area and a higher corrosion rate. However, at higher surface concentration of NaCl a spatial interaction effect between the local corrosion sites counteracted the increase in the corrosion rate due to overlap of the cathodic areas from the particles. Another factor, which influenced the corrosion process, was the effect of on the pH of the surface electrolyte. Higher pH ( concentration) increased the formation of CuO, which improved the corrosion resistance of the corrosion product layer but hindered the formation of insoluble CuCl, whereby more soluble chloride ions were available for triggering localized corrosion and accelerating the initial atmospheric corrosion of copper. Hence, the overall influence of and NaCl depends on at least three identified mechanisms.

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