Abstract
Pressure pulsation is notable for improving diffusion bonding process by breaking oxide layer present at the faying metal surfaces while an increased bonding pressure is envisaged to produce more compressive deformation (squeezing effect) on the reaction layer. This work aims at improving inter-atomic intersperse and mechanical properties of Al/Cu joint via the control of the bonding-compressive pressure. The bonding temperature (600 °C) and time (60 min) were kept constant while the bonding pressure was varied between 5 and 12.5 MPa. The metallurgical and mechanical properties of the joint were studied. The results revealed that an oxide-free bond interface was produced in a pressure range of 5–12.5 MPa. The rise in the bonding pressure (5–12.5 MPa) increases the bond strength (78.39–108.47 MPa) and the diffusion depth (11.32–20.87 µm) between the Al/Cu interfaces. Five (5) distinctive regions having CuAl2.4, Al1.3Cu3.1Sn, Al2.5Cu1.5Sn, CuAl1.8 and AlCu2.3Sn1.4 phases were formed within the reaction layer due to the varying level of interspersing/inter-atomic diffusion. Maximum hardness increases with bonding pressure level towards the Cu side from 57 to 111 HV due to the precipitation of Al2.5Cu1.5Sn and AlCu2.3Sn1.4 phases.
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