Effect of bonding adhesive thickness on temperature characteristics and strain characteristics of SAW strain sensors

Abstract

Accurate measurement of physical parameters based on sensing technology is an important basis for equipment structural health monitoring technology. In harsh environments, strain measurement techniques based on SAW sensors have attracted much attention. The bonding adhesive is a key step in the strain measurement process, and its effect on the accuracy of the measurement results cannot be ignored. In this paper, the one-port resonant SAW strain sensor is prepared using LiNbO3 as a piezoelectric substrate, Pt as an electrode and SiO2 as a protective layer. The strain characteristics and temperature characteristics of SAW strain sensors at the thickness of the bonding adhesive (Model: DOUBLE-BOND CHEMICAL®DB5016) are explored. The frequency–temperature curves of the SAW sensors show a quasi-linear decreasing trend with increasing temperature, and the temperature–frequency characteristics are similar for different bonding adhesive thicknesses. The strain sensitivity increases and then decreases with increasing temperature, and reaches a maximum at 150 °C. An increase in the thickness of the bonding adhesive leads to a decrease in the temperature linearity and an increase in the temperature sensitivity of the SAW strain sensor, which is maximized at a bonding adhesive thickness of 0.35 mm. The increase in the thickness of the bonding adhesive leads to a decrease in the strain linearity and strain sensitivity of the SAW sensor. The relationship between the strain transfer efficiency of the SAW sensor and the thickness of the bonding layer, the shear modulus of the bonding layer, the length of the sensor, the thickness of the sensor substrate and the shear modulus of the sensor is established through theoretical derivation. A theoretical foundation is provided for the accurate measurement of strain based on SAW technology.