Effect of Blade dicing parameters on Die Strength

Abstract

recently, the 3D wafer become increasingly popular for IC packaging to satisfy the needs of low cost, small size, low-profile features and high performance. Wafer manufacturing process which including grinding and dicing has important influence on die quality. In this paper, the influence of dicing parameters, such as spindle speed and feed speed, on die strength were investigated. And the correlation between chipping size and die strength was discussed. Optical microscope and scanning electronic microscope were used to inspect the chipping morphology and chipping size. Die strength was measured by three point bending test. Experimental results shows that spindle speed of 1.125a can achieve the best less-chipping performance and highest die strength of 426.38MPa. Feed speed of 1.4y can achieve the highest die strength of 435.69MPa. Chipping size was proved to have significant influence on die. Stress concentration induced by chipping is discussed.