Abstract
Minor weight fraction of the BaTiO3 particle is doped into the Sn1.0Ag0.5Cu (SAC) lead-free solder by the mechanically mixing. The effect of BaTiO3 on the microstructure and mechanical properties of the SAC lead-free solder is investigated. The results show that the β-Sn is refined and the volume fraction of the eutectic phase is increased by adding BaTiO3. The β-Sn morphology is transformed from the block into the lamellar in the SAC + 0.2 wt% BaTiO3, and a Cu6Sn5 IMC layer with thickness of about 7.3 μm is obtained. The optimal spreadability of the SAC–0.2BaTiO3 is obtained, and the spreading coefficient reaches 0.7836, it is 23.48 % higher than that of the SAC solder. The ultimate tensile strength and the elongation are improved by the BaTiO3 addition. The fracture surface of the SAC–0.2BaTiO3 solder specimen consists of large amounts of dimples due to the highly ductile manner.
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