Abstract
(1) Applying DC in positive direction may enhance the wetting of liquid pure Sn and Sn-Pb alloy on solid copper substrate. Applying DC in negative direction will enhance the wetting of liquid Sn-Pb/solid Cu, but weaken the wetting of liquid pure Sn/solid Cu. (2) The enhancement is related to the intensity of applying DC and the composition of liquid alloy. Applying DC in too high intensity will hinder the wetting of liquid Sn-Pb/solid Cu.
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