Abstract
The goal of the present work is to investigate the effects of the addition of Sb (0, 3 and 6 wt%) on structure, melting, corrosion and mechanical properties of Sn-Bi eutectic solder alloys. The mechanical properties of the bulk Sn-Bi-Sb solders were higher as the amount of antimony increases, making compressive strength augment from 65 MPa to 100 MPa when 6 wt% Sb was incorporated to the Sn-Bi eutectic alloy. The three alloys presented a melting temperature that is smaller to the one exhibited by the eutectic alloy Sn-38Pb (Tm = 183°C). According to the electrochemical results, the addition of higher contents of Sb to the Sn-Bi eutectic alloy had a positive effect: it ennobled the Ecorr values.
Highlights
Due to the toxicity and harmful environmental effect of Pb present in tin solders, legislation trend to reduce or eliminate the utilization of lead from a wide variety of uses
The mechanical properties of the bulk Sn-Bi-Sb solders were higher as the amount of antimony increases, making compressive strength augment from 65 MPa to 100 MPa when 6 wt% Sb was incorporated to the Sn-Bi eutectic alloy
The mechanical properties of the bulk Sn-Bi-Sb solders were higher as the amount of antimony increases, making compressive strength augment from 65 MPa to almost 100 MPa when 6 wt% Sb was incorporated to the Sn-Bi alloy
Summary
Due to the toxicity and harmful environmental effect of Pb present in tin solders, legislation trend to reduce or eliminate the utilization of lead from a wide variety of uses. There are many different metals and metal alloys that can be used as solders and a set of binary alloys have been chosen as candidates for lead-free solders: Sn-Bi, Sn-Ag, Sn-Zn, Sn-Cu and Sn-Sb. Among the ternary compositions, the Sn-Bi-Zn one was used in making printing wiring boards [1], all of these eutectic compositions have a melting temperature above 200 ̊C. Among the commercial Pb-free alloys, Sn-58 wt% Bi eutectic alloy may be a favorable alloy specially for electronics and telecommunications. Bismuth has been used as the alloying element in ternary Sn-Zn-Bi [4] Sn-Ag-Bi [5,6] and Sn-BiCu [7] systems to provide suitable substitutes for Sn-Pb solder alloys
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