Abstract
80Ni-17Fe-3W alloy films are electroplated on Si wafer. The as-plated film is smoothed and annealed at different substrate temperature values of 200 °C, 300 °C, 400 °C, and 500 °C. The atomic force microscopy results show that the roughness of the as-plated alloy film increases with an increase in the annealing temperature. It is found that an increase in the annealing temperature, the coercivity increases while the electrical resistivity decreases. The plated alloy film annealed at 500 °C has the highest coercivity of 383 A/m and the lowest resistivity of 25 µohm-cm. The coercivity and electrical resistivity of the samples are measured with the help of a BH-Looper and four-point probe techniques, respectively.
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