Abstract
51.39 at.%Ti–48.61 at.%Ni thin films were prepared by magnetron sputtering and post-annealed at 450, 500, 550 and 600 °C, respectively. Crystallization kinetics of as-deposited Ti–Ni thin films was analyzed using differential scanning calorimetry (DSC). The evolution of structure, surface roughness and mechanical properties of Ti–Ni thin film annealed at different temperature were investigated by X-ray diffactometer (XRD), atomic force microscope (AFM) and nanoindention test. The results show that amorphous Ti–Ni thin films were crystallized at 506.3 °C with 18.6 J/g reaction enthalpy. As annealing temperature increased from 450 to 500 °C, crystallization degree of Ti–Ni thin film rose and surface roughness increased as well. As for Ti–Ni thin film annealed above 500 °C, Ti 2Ni phase precipitated and surface roughness first increased and then decreased with increasing annealing temperature. Moreover, amorphous Ti–Ni thin films are softer than crystalline ones. Microhardness and Young's modulus of crystalline Ti–Ni thin films increased with increasing annealing temperature.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.