Abstract
The electrical resistivity ρf, temperature coefficient of resistance αf, and Hall coefficient RH have been measured on annealed copper films (160–1490 A) evaporated at a pressure of ∠10−6 Torr on to glass, mica, and NaCl substrates, held at room temperature. The results are discussed in relation to Fuchs–Sondheimer theory. When the films are heated above their annealing temperatures, they are found to be agglomerated as revealed by the electron micrographs. The temperature at which agglomeration starts is found to be thickness‐dependent. On agglomeration, the electrical resistivity increases, Hall coefficient and Hall mobility decrease, and the temperature coefficient of resistance remains unaltered.
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