Abstract
AbstractElectrodeposition of functional metal surfaces has received great attention because of their useful applications. Recently, interesting electrodeposition behavior of Pt at −0.8 V (vs. Ag/AgCl) was reported, where underpotential deposited H (Hupd) layers played a unique role in the electrodeposition. Here, we report the effect of anionic electrolytes and precursor concentrations on the electrochemical deposition behavior of Pt. Depending on these two experimental parameters, two distinct Pt structures, monolayer Pt films and Pt spheres, were electrodeposited at −0.8 V. In addition to the underpotential deposited H (Hupd) layers formed at −0.8 V, the adsorption of Cl− also plays a significant role in determining the electrodeposited Pt structures. When the PtCl42− concentration was low and the Cl− concentration was high enough for the adsorption of PtCl42− to be blocked by the Hupd and Cl− layers, monolayer Pt films were electrodeposited. Otherwise, further electrodeposition of Pt spheres over the monolayer Pt films occurred. The effect of other halide ion adsorption and the controlled growth of Pt spheres during the Pt electrodeposition were also investigated. The electrochemical deposition behavior of Pt demonstrated in this work provides insight into the fabrication of functional Pt surfaces.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
