Abstract
Alumina nanowires (Al2O3-NWs)/epoxy resin composites have been thoroughly studied due to their excellent insulating and dielectric performance. In particular, understanding the effect of nano-alumina with different morphologies on the dielectric performance of composites is of great significance. In this study, Al2O3-NWs with lengths of approximately 100 nm and diameters of approximately 5 nm were prepared and blended with anepoxy resin to form composites, and the effect of the mass fraction of fillers on the thermal conductivity of the composites was investigated. Specifically, the effect of alumina fillers with ananowire structure on the insulating and dielectric performance and breakdown strength of the epoxy composites were analyzed. The influence principle of the interfacial effect and heat accumulation on the dielectric and insulating properties of the composites were described. The results demonstrated that the thermal conductivity of Al2O3-NWs/epoxy resin composites was higher than that of the bare epoxy resin. The thermal conductivity of Al2O3-NWs/epoxy resin composites increased with increasing mass fraction of fillers. When the mass fraction of fillers was 10%, the thermal conductivity of the composite was 134% higher than that of the epoxy resin matrix. The volume resistivity of the composites first increased and then decreased as the mass fraction of fillers increased, while the dielectric constant of the composites increased with increasing mass fraction of fillers and decreasing frequency. The dielectric loss of the composites decreased and then increased as the mass fraction of fillers increased, and it increased with increasing frequency. Additionally, the alternating current breakdown strength of the composites first increased and then decreased withincreasingmass fraction of fillers.
Highlights
Epoxy resins have excellent mechanical and insulation performance and are widely used in the field of electrical and electronic information
The results reveal that the dielectric constant of the composites increased with increasing mass fraction of Al2 O3 -NWs, which was greater than the dielectric constant of the pure epoxy resin
Al2 O3 -NWs/epoxy resin composites with different mass ratios were prepared
Summary
Epoxy resins have excellent mechanical and insulation performance and are widely used in the field of electrical and electronic information. The breakdown strength of epoxy resins is as high as 28 KV/mm, the dielectric constant at power frequency is approximately 3.5, and the mechanical elasticity can reach 53 GPa [1,2]. The integration of electronics and chips has been increasing due to the development of electrical and electronic technology, which generates increased heat accumulation within the electronic devices. This results in higher environmental temperatures in electrical equipment during operation, which reduces the stability of the equipment and reduces its service life. It is especially important to improve the thermal conductivity of insulating materials [3,4].
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