Effect of alloying with palladium on the electrical and mechanical properties of copper

Abstract

Structure and physicomechanical properties of Cu–Pd alloys that contain 0.5–5.9 at % Pd have been studied. It has been shown that, in all alloys, a solid solution is formed; the lattice parameter of the fcc lattice and the electrical resistivity of the alloys grow linearly with an increase in the content of palladium. It has also been revealed that the introduction of palladium leads to an increase in the recrystallization temperature and to an increase in the strength properties. The assumption on the formation of an atomic short-range order in the quenched Cu–4.6 at %Pd and Cu–5.9 at %Pd alloys has been made.