Abstract
Local electrochemical deposition (LECD) is an economical and efficient three-dimensional (3D) microstructure fabrication method. In this study, micro copper columns were deposited by LECD by using additive aliphatic-amine ethoxy sulfonates (AESS), with a 20 μm diameter microanode. The effect of AESS on the micro copper columns diameter and surface quality were studied. The presence of 1 mg l−1 AESS can improved the surface quality of columns and decreased the diameter of columns, the inhibitor and leveling effect mechanism of AESS were discussed based on the adsorption behavior. Furthermore, the effect of applied voltage and step length were investigated with 1 mg l−1 AESS, and the optimized step length and deposition voltage were obtained. The structure and surface morphology of columns fabricated with different parameters were compared and discussed.
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