Abstract
The present study analyzed the influence of aging time on the microstructure and mechanical properties of a TA3/10CrNiCu bonding interface fabricated via hot compression bonding (HCB) with vanadium (V) as the interlayer. The results show that there are no obvious defects and intermetallic compounds (IMCs) at the interface without aging. With aging at 850 °C for 1 and 4 h, the IMC (FeV)σ, VC, and discontinuous micro-voids appeared at the V/steel interface, while a continuous reaction layer formed after an aging time of up to 24 h. In contrast, the V/Ti interface formed a continuous solid solution (SS) at different aging times. The addition of V prevented the formation of Fe-Ti IMCs at the interface when the titanium and steel were directly bonded, but the tensile strength decreases from 422 MPa to 270 MPa with the increase of aging time due to the presence of (FeV)σ, VC, and micro-voids after high-temperature aging.
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