Abstract
The electrical migration effects on microstructure and creep properties evolution in NiAu/Sn-5Sb/AuNi and NiAu/Sn-5Sb-0.7Ag-0.5Cu/AuNi solder joint were investigated. The results showed that the thickness of interfacial IMC in the two solder joints have a linear relationship with the current stressing time. After 400 h of current stressing, (Ni, Cu)3Sn4 at the interfacial IMC transformed to composition of (Ni, Cu)3Sn4 and (Cu, Ni)6Sn5 at the cathode side of NiAu/Sn-5Sb/AuNi. With the increase in the current stressing time, the grain coarsening of Ni3Sn4, (Ni, Cu)3Sn4 and Ag3Sn became more and more serious, resulting in the decrease of creep stress exponent of solder joints. The creep stress exponent of NiAu/Sn-5Sb/AuNi and NiAu/Sn-5Sb-0.7Ag-0.5Cu/AuNi solder joints decreased by 28 % and 22 % respectively, after 400 h of current stressing. Addition of 0.5 wt% Cu and 0.7 wt% Ag can significantly reduce the grain coarsening effect. The NiAu/Sn-5Sb-0.7Ag-0.5Cu/AuNi solder joints have a thinner interfacial IMC and higher creep stress exponent than the NiAu/Sn-5Sb/AuNi solder joint. This demonstrates that the co-addition of Ag and Cu can improve the creep resistance and electromigration resistance of NiAu/Sn-5Sb/AuNi solder joints.
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