Effect of Addition of Trace Ni and Ge into Sn-Sb-Ag High Temperature Lead-free Solder Alloy on its Mechanical Properties

Kohei Mitsui, Tatsuya Kobayashi + Show 2 more

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https://doi.org/10.7791/jspmee.9.133

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Journal: Journal of Smart Processing	Publication Date: May 10, 2020
Citations: 2	License type: free

Abstract

Effect of Addition of Trace Ni and Ge into Sn-Sb-Ag High Temperature Lead-free Solder Alloy on its Mechanical Properties

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