Abstract
We investigated the effect of adding cerium (Ce) to low Ag content Sn–1.0wt.%Ag solder on the interfacial reactions between the Sn–1.0Ag solder and Cu substrate. The formation and growth of interfacial intermetallic compounds (IMCs) between the Sn–1.0Ag–0.3Ce solder and Cu substrate were studied and the results were compared to those obtained for the Ce-free Sn–1.0Ag/Cu and most promising Sn–3.0Ag–0.5Cu/Cu systems. The addition of Ce to the Sn–Ag solder significantly reduced the growth of the interfacial Cu–Sn IMCs, retarded the interfacial reactions between the solder and the substrate, and prevented the IMC from spalling from the interface. The Sn–1.0Ag–0.3Ce solder alloy had a good interfacial stability with the Cu substrate during solid-state isothermal aging in the viewpoint of IMC growth.
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