Abstract
The work presented in this paper focuses on the role of 3 wt% Bi in the base Sn-9%Zn solder on the shear strengths and the interfacial reactions with Au/Ni/Cu pad metallization in ball grid array (BGA) applications. Sn-Zn-Bi solders showed better results in terms of shear strength on liquid state annealing than Sn-Zn solders. Two failure modes, ball cut and interfacial intermetallics/pad separation are assessed for the different solders and reflow times. The consumption of Ni in the Sn-Zn solder was larger than that in the Bi-containing solder. By the addition of 3% Bi in the eutectic Sn-Zn solder, the formation of Ni-Zn compound is reduced which in turn increase the reliability of the solder joint to the higher extent.
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