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Abstract
A solder/substrate couple consisting of a Nb substrate and eutectic 52In–48Sn solder shows promise for high-temperature liquid solder interconnects. In this letter, the intermetallic compound (IMC) crystal growth between vacuum-sputtered Nb film and molten 52In–48Sn solder at four temperatures; 192, 220, 240, and 260°C, was investigated employing samples with a solder/substrate interface area of 7mm by 7mm. It was found that at all four temperatures, the IMC crystals nucleated and grew first at the corners of the substrate, followed by the edges, and then gradually covered the entire interface. This result, can be explained if the initiation of IMC crystal growth is diffusion controlled, and the value of the Nb diffusion coefficient is estimated with the aid of a three-dimensional numerical simulation.
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