ECR RIE-Enhanced Low Pressure Plasma Etching of GaN/InGaN/AlGaN Heterostructures

Abstract

A room temperature (RT) plasma etch process has been developed to non-selectively etch GaN/InGaN/AlGaN structures, grown on sapphire substrates, using an electron cyclotron resonance (ECR) plasma source with RIE enhancement. The process chemistry chosen was Cl2/CH4 based in order to facilitate the formation of volatile etch by-products, typically to form group III halides and group V hydrides, although indium is more likely to form an organo-metallic compound as opposed to a chloride. A characteristic of this process is the very smooth sidewall features obtained and the controllability of the etch profile via ECR power, table bias and/or gas flow ratio. Typical results obtained using a RT process were etch rate above 100 nm/min., selectivity to resist mask above 30:1 and smooth anisotropic profile at low ion-energies (below 100 eV). The process etch rate showed a characteristic increase with increasing table bias (above 130 nm/min.) with only small changes in the relative etch rate of each compound (i.e. selectivity maintained at roughly 1:1), however, this etch does rely upon competing etching and deposition mechanisms and thus too large a variation in one parameter without a corresponding compensation with another leads to a rough surface and a more selective etch. The process has also been demonstrated using a metal mask (e.g. Ni) and present work is progressing onto other gas combinations and the use of high temperature electrodes.