Abstract

Urea-formaldehyde (UF) resin is one of the most widely used resin adhesive for wood-based panels. The main concern of UF resin bonded wood-based panels is formaldehyde emission and poor water resistance. In this study, activated soybean protein isolate (SPI) was used to modify UF resin for the production of eco-friendly fiberboard panels. The effects of different activated SPI on the properties of UF resins and the resin bonded medium-density fiberboard (MDF) panels were investigated. The free formaldehyde content of the urea-activated SPI modified UF resin was only 0.13 %. Approximately 27.8 % lower than that of the unmodified UF resin. The resin bonded MDF panel with a density of 760 kg/m3 shows a modulus of rupture (MOR) and modulus of elasticity (MOE) of 45.73 MPa and 4005 MPa, which is increased by 25 % and 15 % compared to the unmodified UF resin group. The internal bonding strength (IB) reaches 0.71 MPa, which is about 15 % higher than that of the unmodified UF resin group. The tested 24-hour thickness swelling (24 h TS) of the modified UF resin group is only 8.1 %. The tested formaldehyde content of the sodium dodecyl sulfate (SDS)-activated SPI modified UF resin bonded MDF panel is only 4.8 mg/100 g, which is 20 % lower than that of the control UF resin group. The activated SPI modified UF resin shows great improvement in bonding strength and lower formaldehyde content for MDF panels as compared to the pure UF resin. The chemical groups, crystalline properties, and thermal stability of the pure and the modified UF resins were characterized via Fourier transform infrared spectroscopy (FTIR), X-ray diffraction (XRD), and thermogravimetric (TG) analysis. It is confirmed that the activated SPI modified UF resin has similar chemical structure, higher ratio of crystalline regions, and slightly lower thermal stability with compared to the pure UF resin. This study proposes a practical and applicable solution for the utilization of eco-friendly UF resin in wood-based panel production.

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