Abstract
An eco-friendly, economic and particle-free reactive solution is developed by Ming-Tsang Lee and co-workers, article number 2101069, for rapid laser digital patterning of highly conductive copper microstructures on flexible and transparent substrates. Laser post-processing is applied to further improve the electrical conductivity and robustness. This novel material and laser micro-additive manufacturing technique enable green microfabrication for flexible and 3D electronics.
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