Abstract
In this work copper with high density twins was obtained by pulsed electrodeposition technique. The crystallographic parameters and the grain size of the electrodeposited copper were determined using the electron back scattering diffraction (EBSD) technique and were compared with those obtained from transmission electron microscopy (TEM) and X-ray analyses. The average grain sizes of the as-deposited Cu determined from XRD, EBSD and TEM were 82.9 nm, 1.035 μm, and 0.5 μm to 1.0 put, respectively. There existed a {220} preferred orientation in the as-deposited Cu and the ratio of twin boundaries to total grain boundaries was 37.98%.
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